US 11,862,533 B2
Fluid-cooled package having shielding layer
Andreas Grassmann, Regensburg (DE); Wolfram Hable, Neumarkt (DE); Juergen Hoegerl, Regensburg (DE); Ivan Nikitin, Regensburg (DE); and Achim Strass, Munich (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Dec. 21, 2021, as Appl. No. 17/557,168.
Application 17/557,168 is a continuation of application No. 15/710,852, filed on Sep. 21, 2017, granted, now 11,244,886.
Claims priority of application No. 102016117843.8 (DE), filed on Sep. 21, 2016.
Prior Publication US 2022/0115293 A1, Apr. 14, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/42 (2006.01); H01L 23/495 (2006.01); H01L 23/552 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/42 (2013.01) [H01L 23/3735 (2013.01); H01L 23/473 (2013.01); H01L 23/49531 (2013.01); H01L 23/552 (2013.01); H01L 23/3121 (2013.01); H01L 23/49575 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/3025 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package, comprising:
at least one electronic chip;
an encapsulant encapsulating at least part of the at least one electronic chip;
a shielding layer on at least part of an external surface of the encapsulant; and
a first heat removal body thermally coupled to the at least one electronic chip and configured for removing thermal energy from the at least one electronic chip to a cooling fluid,
wherein the encapsulant has a surface portion that extends in a surface region extending laterally directly adjacent to the first heat removal body,
wherein the surface portion of the encapsulant delimits part of a cooling cavity configured to guide the cooling fluid,
wherein the shielding layer covers the surface portion of the encapsulant.