CPC H01L 23/42 (2013.01) [H01L 23/3735 (2013.01); H01L 23/473 (2013.01); H01L 23/49531 (2013.01); H01L 23/552 (2013.01); H01L 23/3121 (2013.01); H01L 23/49575 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/3025 (2013.01)] | 20 Claims |
1. A package, comprising:
at least one electronic chip;
an encapsulant encapsulating at least part of the at least one electronic chip;
a shielding layer on at least part of an external surface of the encapsulant; and
a first heat removal body thermally coupled to the at least one electronic chip and configured for removing thermal energy from the at least one electronic chip to a cooling fluid,
wherein the encapsulant has a surface portion that extends in a surface region extending laterally directly adjacent to the first heat removal body,
wherein the surface portion of the encapsulant delimits part of a cooling cavity configured to guide the cooling fluid,
wherein the shielding layer covers the surface portion of the encapsulant.
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