US 11,862,505 B2
Processing apparatus
Yoshinori Kakinuma, Tokyo (JP); Takashi Mori, Tokyo (JP); and Yoshinobu Saito, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Feb. 15, 2022, as Appl. No. 17/651,114.
Claims priority of application No. 2021-026588 (JP), filed on Feb. 22, 2021.
Prior Publication US 2022/0270911 A1, Aug. 25, 2022
Int. Cl. B32B 43/00 (2006.01); H01L 21/683 (2006.01); H01L 21/677 (2006.01); B23K 26/364 (2014.01); B23K 26/402 (2014.01); B25J 11/00 (2006.01); H05B 1/02 (2006.01); B23K 103/00 (2006.01)
CPC H01L 21/6836 (2013.01) [B23K 26/364 (2015.10); B23K 26/402 (2013.01); B25J 11/0095 (2013.01); H01L 21/67775 (2013.01); H01L 21/6838 (2013.01); B23K 2103/56 (2018.08); B32B 43/006 (2013.01); H05B 1/0233 (2013.01); Y10T 156/1158 (2015.01); Y10T 156/1917 (2015.01)] 13 Claims
OG exemplary drawing
 
1. A processing apparatus that removes a beveled part formed in an outer circumferential surplus region from a wafer in a ring manner, the processing apparatus comprising:
a wafer cassette table on which a wafer cassette in which a plurality of wafers are housed is placed;
a wafer carrying-out unit that carries out the wafer from the wafer cassette placed on the wafer cassette table;
a wafer table that supports the wafer carried out by the wafer carrying-out unit;
a frame housing unit that houses a plurality of annular frames in which an opening part that houses the wafer is formed;
a frame carrying-out unit that carries out an annular frame from the plurality of annular frames in the frame housing unit;
a frame table that supports the annular frame carried out by the frame carrying-out unit;
a tape sticking unit that is disposed over the frame table and sticks a tape to the annular frame;
a tape-attached frame conveying unit that conveys the annular frame to which the tape is stuck to the wafer table and positions the opening part of the annular frame to one surface of the wafer supported by the wafer table and places a tape-attached frame on the wafer table;
a tape pressure bonding unit that executes pressure bonding of the tape of the tape-attached frame to the one surface of the wafer;
frame unit carrying-out means that carries out a frame unit in which the tape of the tape-attached frame and the one surface of the wafer are pressure-bonded by the tape pressure bonding unit from the wafer table;
a beveled part removing unit that cuts and removes, in a ring manner, the beveled part formed in the outer circumferential surplus region from the wafer of the frame unit carried out by the frame unit carrying-out means;
beveled-part-free unit carrying-out means that carries out a beveled-part-free unit resulting from the removal of the beveled part in the ring manner from the beveled part removing unit; and
a frame cassette table on which a frame cassette that houses the beveled-part-free unit carried out by the beveled-part-free unit carrying-out means is placed.