US 11,862,501 B2
Electrostatic chuck and substrate fixing device
Norio Shiraiwa, Nagano (JP); and Kazuya Takada, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Sep. 9, 2021, as Appl. No. 17/470,574.
Claims priority of application No. 2020-152713 (JP), filed on Sep. 11, 2020.
Prior Publication US 2022/0084866 A1, Mar. 17, 2022
Int. Cl. H01T 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/6833 (2013.01) [H01L 21/68757 (2013.01); H01L 21/68785 (2013.01)] 5 Claims
OG exemplary drawing
 
1. An electrostatic chuck comprising:
a plurality of ceramic substrates each having a step formed at a peripheral edge portion of one surface, the ceramic substrates being arranged adjacent to each other so that the steps face each other;
electrodes each embedded in each of the plurality of ceramic substrates; and
a filling portion that fills a groove portion formed by the facing steps of the adjacent ceramic substrates,
wherein the filling portion is formed in a position in which it does not overlap the electrodes, as seen from above and side.