US 11,862,497 B2
Method for die-level unique authentication and serialization of semiconductor devices using electrical and optical marking
H. Jim Fulford, Albany, NY (US); Anthony Schepis, Albany, NY (US); and Anton J. Devilliers, Clifton Park, NY (US)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jul. 21, 2021, as Appl. No. 17/381,297.
Application 17/381,297 is a division of application No. 16/528,099, filed on Jul. 31, 2019, granted, now 11,133,206.
Claims priority of provisional application 62/834,093, filed on Apr. 15, 2019.
Prior Publication US 2021/0351053 A1, Nov. 11, 2021
Int. Cl. H01L 23/48 (2006.01); H01L 21/67 (2006.01); H01L 23/544 (2006.01); H01L 21/027 (2006.01); H01L 23/528 (2006.01)
CPC H01L 21/67282 (2013.01) [H01L 21/0275 (2013.01); H01L 23/528 (2013.01); H01L 23/544 (2013.01); H01L 2223/5444 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device with authentication, the device comprising:
a die formed of a semiconductor substrate and containing an integrated circuit, the die having a plurality of field-effect transistors and multiple wiring levels, the multiple wiring levels having been patterned using a mask-based photolithography system; and
a unique wiring structure formed on a predetermined region of the die, the unique wiring structure having been patterned using a direct-write projection system, the unique wiring structure having a unique electrical signature that identifies the die relative to other dies,
wherein the unique wiring structure is positioned on the predetermined region which is separated from die circuitry.