CPC H01L 21/67138 (2013.01) [C23C 18/08 (2013.01); H01L 21/485 (2013.01)] | 16 Claims |
1. An electrical interconnection system, comprising:
a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components;
a machined ramp passing through the second semiconductor substrate between one of the first electrical components and one of the second electrical components; and a 3D printed conductive trace formed on the machined ramp to electrically connect the one first electrical component and the one second electrical component.
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