US 11,862,491 B2
Apparatus and method for treating substrate
Dohyeon Yoon, Cheonan-si (KR); Joo Jib Park, Asan-si (KR); and Jin Se Park, Incheon (KR)
Assigned to Semes Co., Ltd., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Jul. 10, 2020, as Appl. No. 16/925,449.
Claims priority of application No. 10-2019-0083570 (KR), filed on Jul. 11, 2019.
Prior Publication US 2021/0013064 A1, Jan. 14, 2021
Int. Cl. H01L 21/67 (2006.01); B08B 7/00 (2006.01); H01L 21/02 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/67115 (2013.01) [B08B 7/0021 (2013.01); H01L 21/02101 (2013.01); H01L 21/67034 (2013.01); H01L 21/67742 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for treating a substrate, the apparatus comprising:
a light treatment chamber having an interior space;
a support unit configured to support the substrate in the interior space; and
an irradiation unit disposed above the support unit and configured to irradiate light downward to the substrate in the interior space to remove organic matter remaining on the substrate,
wherein the irradiation unit includes:
a first light source configured to irradiate first light to the substrate;
a second light source configured to irradiate second light to the substrate, the second light having a different wavelength range from the first light,
the first light is disposed at a different height from the second light source,
the first light source having a wavelength of 300 nm to 1000 nm, and
the second light source having a wavelength of at least one of 185 nm, 254 nm, and 400 nm or more.