US 11,862,443 B2
Sputtering target
Toshiaki Kuroda, Niihama (JP); and Mikio Takigawa, Niihama (JP)
Assigned to SUMITOMO CHEMICAL COMPANY, LIMITED, Tokyo (JP)
Filed by SUMITOMO CHEMICAL COMPANY, LIMITED, Tokyo (JP)
Filed on Nov. 2, 2020, as Appl. No. 17/087,333.
Application 17/087,333 is a division of application No. 15/935,605, filed on Mar. 26, 2018, granted, now 10,861,684.
Claims priority of application No. 2017-064985 (JP), filed on Mar. 29, 2017; and application No. 2017-183878 (JP), filed on Sep. 25, 2017.
Prior Publication US 2021/0057196 A1, Feb. 25, 2021
Int. Cl. H01J 37/34 (2006.01); C23C 14/34 (2006.01); C23C 14/35 (2006.01); C23C 14/14 (2006.01); C23C 14/16 (2006.01)
CPC H01J 37/3423 (2013.01) [C23C 14/14 (2013.01); C23C 14/165 (2013.01); C23C 14/3407 (2013.01); C23C 14/35 (2013.01); H01J 37/3405 (2013.01); H01J 37/3426 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A sputtering target comprising a target material, wherein a sputtering face of the target material has a circular shape and a ramp, wherein
the target material includes a flat circular first region positioned at a center of the sputtering face, and a flat ring-shaped second region positioned around the first region, wherein
the ramp has been provided so as to reduce a thickness of the target material, toward inner part of the sputtering face in the radial direction of the sputtering face between the first region and the second region, wherein
a diameter of the first region accounts for 32% or more and 58% or less of a diameter of the sputtering face, and
a thickness of the ramp is 0.5 mm to 5 mm, wherein
the thickness of the first region is 10 mm to 30 mm, wherein
the ring width of the second region is 5 mm to 75 mm.