US 11,862,404 B2
Multilayer electronic component for enhanced moisture resistance and bending strength
Dong Yeong Kim, Suwon-si (KR); Ji Hong Jo, Suwon-si (KR); and Woo Chul Shin, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on May 26, 2022, as Appl. No. 17/825,289.
Application 17/825,289 is a continuation of application No. 16/836,125, filed on Mar. 31, 2020, granted, now 11,501,922.
Claims priority of application No. 10-2019-0105819 (KR), filed on Aug. 28, 2019.
Prior Publication US 2022/0293347 A1, Sep. 15, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 2/02 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 2/02 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1218 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including dielectric layers, and first and second internal electrodes alternately stacked with respective dielectric layers interposed therebetween, the body having first and second surfaces opposing each other in a stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;
a first external electrode including a first electrode layer connected to the first internal electrode and a first conductive resin layer disposed on the first electrode layer, the first external electrode having a first connection portion disposed on the third surface of the body and a first band portion extending from the first connection portion to a portion of each of the first, second, fifth, and sixth surfaces;
a second external electrode including a second electrode layer connected to the second internal electrode and a second conductive resin layer disposed on the second electrode layer, the second external electrode having a second connection portion disposed on the fourth surface of the body and a second band portion extending from the second connection portion to a portion of each of the first, second, fifth, and sixth surfaces; and
a silicon (Si) organic compound layer having a body cover portion disposed on a region of external surfaces of the body between the first and second electrode layers, a first extending portion extending from the body cover portion to a region between the first electrode layer and the first conductive resin layer of the first band portion, and a second extending portion extending from the body cover portion to a region between the second electrode layer and the second conductive resin layer of the second band portion,
wherein at least one of the first extending portion of the first band portion or the second extending portion of the second band portion has openings, and
the first extending portion covers an end of the first electrode layer, and the second extending portion covers an end of the second electrode layer.