US 11,862,399 B2
Multilayered electronic component and dielectric composition
Kyung Sik Kim, Suwon-si (KR); Jong Hwan Lee, Suwon-si (KR); Jeong Yun Park, Suwon-si (KR); Tae Young Ham, Suwon-si (KR); In Tae Seo, Suwon-si (KR); and Jae Sung Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on May 12, 2021, as Appl. No. 17/318,497.
Claims priority of application No. 10-2020-0183641 (KR), filed on Dec. 24, 2020.
Prior Publication US 2022/0208454 A1, Jun. 30, 2022
Int. Cl. H01G 4/12 (2006.01); H01G 4/30 (2006.01); C04B 35/468 (2006.01)
CPC H01G 4/1227 (2013.01) [C04B 35/4682 (2013.01); H01G 4/30 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3236 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/442 (2013.01); C04B 2235/785 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A multilayer electronic component, comprising:
a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and
an external electrode disposed on the body,
wherein a ratio of a number of dielectric grains having a size of 100 to 250 nm included in the dielectric layer is 55% or more with respect to a total number of the dielectric grains included in the dielectric layer,
wherein the dielectric layer comprises a dielectric composition including a BaTiO3-based main component and a first subcomponent,
wherein the first subcomponent comprises BaCO3 and SiO2, and
wherein a content of BaCO3 is 4.0 mole % or more, relative to 100 mole of Ti of the main component, or a content of SiO2 is 7.0 mole % or more, relative to 100 mole of Ti of the main component.