US 11,862,397 B2
Ceramic electronic device and manufacturing method of the same
Riki Suemasa, Takasaki (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Mar. 4, 2022, as Appl. No. 17/687,481.
Claims priority of application No. 2021-043794 (JP), filed on Mar. 17, 2021.
Prior Publication US 2022/0301771 A1, Sep. 22, 2022
Int. Cl. H01G 4/008 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/0085 (2013.01) [H01G 4/30 (2013.01); H01G 4/1227 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A ceramic electronic device comprising:
a multilayer structure in which each of a plurality of dielectric layers including Ba and Ti and each of a plurality of internal electrode layers including Ni and Sn are alternately stacked,
wherein a discontinuity is formed in at least one of the plurality of internal electrode layers, the discontinuity being a break in a cross section including a stacking direction of the multilayer structure, and
wherein an Sn high concentration portion, of which an Sn concentration is higher than an average Sn concentration of the one of the internal electrode layers, is formed on a part of a surface of the at least one of the internal electrode layers, the part of the surface being exposed to the discontinuity.