US 11,860,548 B2
Method for characterizing a manufacturing process of semiconductor devices
Wim Tjibbo Tel, Helmond (NL); Hermanus Adrianus Dillen, Maarheeze (NL); Marc Jurian Kea, Morgan Hill, CA (US); Mark John Maslow, Eindhoven (NL); Koen Thuijs, Vaught (NL); Peter David Engblom, Hillsboro, OR (US); Ralph Timotheus Huijgen, Hillsboro, OR (US); Daan Maurits Slotboom, Wolphaartsdijk (NL); and Johannes Catharinus Hubertus Mulkens, Valkenswaard (NL)
Assigned to ASML NETHERLANDS B.V., Veldhoven (NL)
Appl. No. 17/425,355
Filed by ASML NETHERLANDS B.V., Veldhoven (NL)
PCT Filed Feb. 6, 2020, PCT No. PCT/EP2020/053025
§ 371(c)(1), (2) Date Jul. 23, 2021,
PCT Pub. No. WO2020/169355, PCT Pub. Date Aug. 27, 2020.
Claims priority of provisional application 62/958,928, filed on Jan. 9, 2020.
Claims priority of provisional application 62/890,091, filed on Aug. 22, 2019.
Claims priority of provisional application 62/865,425, filed on Jun. 24, 2019.
Claims priority of provisional application 62/807,854, filed on Feb. 20, 2019.
Prior Publication US 2022/0100098 A1, Mar. 31, 2022
Int. Cl. G03F 7/00 (2006.01)
CPC G03F 7/705 (2013.01) [G03F 7/7065 (2013.01); G03F 7/70525 (2013.01); G03F 7/70658 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A method comprising:
obtaining image data of a plurality of features on at least part of at least one region on a substrate;
using the image data to obtain one or more dimensions of at least some features out of the plurality of features;
determining a value of a statistical parameter based on a value of variation of the one or more dimensions and a mean value of the one or more dimensions;
obtaining a probability of defective manufacture of features in dependence on a determined number of defective features in the image data; and
determining, using a hardware computer, a characteristic of one or more processes for manufacturing features on a substrate by deriving a relation between the probability of defective manufacture of features and the value of the statistical parameter.