US 11,860,538 B2
Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device
Takeshi Kawabata, Haibara-gun (JP); Yu Iwai, Haibara-gun (JP); and Akinori Shibuya, Haibara-gun (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Aug. 15, 2019, as Appl. No. 16/541,794.
Application 16/541,794 is a continuation of application No. PCT/JP2018/005202, filed on Feb. 15, 2018.
Claims priority of application No. 2017-029202 (JP), filed on Feb. 20, 2017.
Prior Publication US 2019/0369496 A1, Dec. 5, 2019
Int. Cl. C08L 79/08 (2006.01); C08L 79/04 (2006.01); C08L 79/00 (2006.01); B32B 15/08 (2006.01); B32B 27/28 (2006.01); G03F 7/031 (2006.01); C08G 73/12 (2006.01); G03F 7/038 (2006.01); H01L 23/29 (2006.01); H01L 23/532 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/38 (2006.01)
CPC G03F 7/031 (2013.01) [B32B 27/281 (2013.01); C08G 73/128 (2013.01); G03F 7/038 (2013.01); H01L 23/293 (2013.01); H01L 23/5329 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/2004 (2013.01); G03F 7/325 (2013.01); G03F 7/38 (2013.01)] 20 Claims
 
1. A photosensitive resin composition comprising:
a heterocyclic ring-containing polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; and
a solvent;
wherein an amine value of the heterocyclic ring-containing polymer precursor is 0.0010 to 0.0300 mmol/g; and
wherein a solid content of the photosensitive resin composition has an amine value of 0.0002 to 0.0200 mmol/g.