US 11,860,065 B2
Method for leak testing and reference leak device for leak testing
Mao Hirata, Tokyo (JP); Tsutomu Hara, Tokyo (JP); Naoto Izumo, Tokyo (JP); and Masaharu Sugihara, Tokyo (JP)
Assigned to FUKUDA CO., LTD., Tokyo (JP)
Filed by FUKUDA CO., LTD., Tokyo (JP)
Filed on Dec. 20, 2021, as Appl. No. 17/556,042.
Application 17/556,042 is a division of application No. 16/301,906, granted, now 11,248,984, previously published as PCT/JP2017/007664, filed on Feb. 28, 2017.
Claims priority of application No. 2016-108114 (JP), filed on May 31, 2016.
Prior Publication US 2022/0113218 A1, Apr. 14, 2022
Int. Cl. G01M 3/32 (2006.01); G01M 3/26 (2006.01); G01M 3/02 (2006.01); G01M 3/00 (2006.01)
CPC G01M 3/3263 (2013.01) [G01M 3/02 (2013.01); G01M 3/26 (2013.01); G01M 3/3281 (2013.01); G01M 3/007 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A reference leak device for leak testing comprising:
a base material having a single known pinhole formed therein; and
an attachment structure attaching to a work, the attachment structure disposed in a peripheral edge portion of the base material,
wherein the attachment structure is disposed so as to surround a work opening formed in the work, the work opening being larger than the pinhole, wherein the attachment structure is configured to seal between the work and the base material, making the work opening and the pinhole of the base material communicable with each other, and,
wherein the attachment structure includes a seal material having a first surface and a second surface, wherein the seal material is thin and has flexibility and has an opening formed in a middle thereof, a peripheral edge portion of the base material is adhered to an inner annular region of one of the first surface and the second surface of the seal material via an adhesive layer, and an adhesive layer for adhering to the work is formed in an outer annular region of the first surface of the seal material.