US 11,859,912 B2
Microelectronics cooling system
Steven Schon, Stafford, PA (US)
Assigned to QCIP Holdings, LLC, Strafford, PA (US)
Filed by Steven Schon, Stafford, PA (US)
Filed on Jun. 1, 2021, as Appl. No. 17/336,126.
Application 17/336,126 is a continuation of application No. 15/636,377, filed on Jun. 28, 2017, abandoned.
Application 15/636,377 is a continuation of application No. 12/459,391, filed on Jun. 30, 2009, abandoned.
Application 12/459,391 is a continuation in part of application No. PCT/US2008/014081, filed on Dec. 26, 2008.
Application PCT/US2008/014081 is a continuation in part of application No. 12/291,544, filed on Nov. 10, 2008, granted, now 9,157,687.
Claims priority of provisional application 61/017,198, filed on Dec. 28, 2007.
Prior Publication US 2022/0136780 A1, May 5, 2022
Int. Cl. H02S 40/44 (2014.01); F28D 15/04 (2006.01); F24S 10/95 (2018.01); F24S 23/74 (2018.01); F28D 15/02 (2006.01)
CPC F28D 15/043 (2013.01) [F24S 10/95 (2018.05); F24S 23/74 (2018.05); H02S 40/44 (2014.12); F28D 2015/0225 (2013.01); Y02B 10/20 (2013.01); Y02B 10/70 (2013.01); Y02E 10/40 (2013.01); Y02E 10/46 (2013.01); Y02E 10/60 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A microelectronics cooling system, comprising:
a) a microchannel heat absorber including an outer heat transfer surface located proximate an outer heat transfer surface of a microelectronic device within an electronic device enclosure and comprising at least one layer defining a plurality of microchannels having a cross-sectional dimension of less than 1000 microns and terminating at a first end in a cool side manifold and at a second end in a warm side manifold, the microchannels adapted to contain a liquid working fluid that absorbs heat from the microelectronic device and forms a vapor upon flowing therethrough from the first end to the second end,
b) a heat sink located outside of the enclosure for receiving and condensing the vapor to reform the liquid working fluid and for discharging the liquid working fluid, and
c) at least one or more pipes flowably connecting the warm side manifold of the heat absorber to the heat sink and flowably connecting the cool side manifold of the heat absorber to the heat sink, wherein the one or more pipes are connected so as to permit simultaneous flow of the vapor from the heat absorber located proximate the heat transfer surface to the heat sink located outside of the enclosure and of the liquid working fluid from the heat sink located outside of the enclosure to the heat absorber when heat is applied to the heat absorber located proximate the heat transfer surface.
 
19. A method of cooling a microelectronic device housed inside an enclosure, comprising
causing a liquid working fluid to flow through a plurality of microchannels in a microchannel heat absorber that includes an outer heat transfer surface proximate an outer heat transfer surface of the microelectronic device within a microelectronic device enclosure and having a cross-sectional dimension to the center of the channel that is equal to or less than the thermal boundary layer thickness for a working fluid,
causing at least some of the working fluid to form a vapor and absorb heat from the microelectronic device,
receiving and condensing the working fluid vapor from the microchannel heat absorber to discharge heat from the fluid outside the enclosure and reform the liquid working fluid, and
continuously returning the condensed working fluid from outside of the enclosure back to the heat absorber in the enclosure.