US 11,859,278 B2
Molecular layer deposition of amorphous carbon films
Bhaskar Jyoti Bhuyan, San Jose, CA (US); Mark Saly, Santa Clara, CA (US); Ahbijit Basu Mallick, Palo Alto, CA (US); Eugene Yu Jin Kong, Singapore (SG); and Bo Qi, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US); and National University of Singapore, Singapore (SG)
Filed on Mar. 12, 2020, as Appl. No. 16/817,120.
Claims priority of provisional application 62/986,768, filed on Mar. 8, 2020.
Prior Publication US 2021/0277516 A1, Sep. 9, 2021
Int. Cl. C23C 16/26 (2006.01); H01L 23/532 (2006.01); H01L 21/02 (2006.01)
CPC C23C 16/26 (2013.01) [H01L 21/02115 (2013.01); H01L 21/02274 (2013.01); H01L 23/53295 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method of depositing a film, the method comprising:
exposing a substrate to a first carbon precursor to form a first precursor terminated surface on the substrate;
exposing the first precursor terminated surface to a second carbon precursor to form a conformal carbon polymer film on the substrate; and
annealing the carbon polymer film at a temperature up to 400° C., wherein annealing the carbon polymer film causes the carbon polymer film to decrease in thickness less than 20%.