CPC C09D 11/34 (2013.01) [B41M 5/0023 (2013.01); C09D 11/03 (2013.01); C09D 11/12 (2013.01); C09D 11/38 (2013.01)] | 13 Claims |
1. A printable non-curable thixotropic hot melt composition for use as a resist during a plating process comprising:
one or more hot melt waxes with an acid functional group, an anhydride group, or an amine functional group; and
a thickener comprising fumed silica, polymeric particles comprising polyolefin particles, or metallic complexes.
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