US 11,859,093 B2
Printable non-curable thixotropic hot melt composition
Lei Wang, San Jose, CA (US); Martin W Bayes, Hopkinton, MA (US); Ting Gao, Palo Alto, CA (US); Kenneth Seufer, Kernersville, NC (US); Philip Singer, Cary, NC (US); and James Zeigler, Harrisburg, PA (US)
Assigned to TE CONNECTIVITY SOLUTIONS GMBH, Schaffhausen (CH)
Filed by TE Connectivity Solutions GMBH, Schaffhausen (CH)
Filed on Mar. 23, 2022, as Appl. No. 17/701,814.
Application 17/701,814 is a continuation in part of application No. 17/213,950, filed on Mar. 26, 2021.
Prior Publication US 2022/0306884 A1, Sep. 29, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C09D 11/34 (2014.01); B41M 5/00 (2006.01); C09D 11/03 (2014.01); C09D 11/12 (2006.01); C09D 11/38 (2014.01)
CPC C09D 11/34 (2013.01) [B41M 5/0023 (2013.01); C09D 11/03 (2013.01); C09D 11/12 (2013.01); C09D 11/38 (2013.01)] 13 Claims
 
1. A printable non-curable thixotropic hot melt composition for use as a resist during a plating process comprising:
one or more hot melt waxes with an acid functional group, an anhydride group, or an amine functional group; and
a thickener comprising fumed silica, polymeric particles comprising polyolefin particles, or metallic complexes.