	US 11,859,092 B2
	Printable non-curable thixotropic hot melt composition
Lei Wang, San Jose, CA (US); Martin W. Bayes, Hopkinton, MA (US); Ting Gao, Palo Alto, CA (US); Philip Singer, Greensboro, NC (US); and James Zeigler, Harrisburg, PA (US)
Assigned to TE CONNECTIVITY SOLUTIONS GMBH, Schaffhausen (CH)
Filed by TE Connectivity Solutions GmbH, Schaffhausen (CH)
Filed on Mar. 26, 2021, as Appl. No. 17/213,950.
Prior Publication US 2022/0306883 A1, Sep. 29, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C09D 11/34 (2014.01); C08K 3/36 (2006.01); C08L 91/06 (2006.01); C23F 1/02 (2006.01)

CPC C09D 11/34 (2013.01) [C08K 3/36 (2013.01); C08L 91/06 (2013.01); C23F 1/02 (2013.01)]

13 Claims

1. A printable non-curable thixotropic hot melt composition for use as a resist during a plating process comprising:

one or more hot melt waxes with acid functional groups, anhydride groups, or an amine functional group; and

a thickener comprising fumed silica, polymeric particles having a melting point higher than a mixing temperature and a printing temperature of the composition, or metallic complexes, such metallic complexes comprising lithium or aluminum.