US 11,859,064 B2
Methods of modifying a substrate by elastocapillary deformation
Prantik Mazumder, Ithaca, NY (US); and Wageesha Senaratne, Horseheads, NY (US)
Assigned to CORNING INCORPORATED, Corning, NY (US)
Appl. No. 17/056,950
Filed by CORNING INCORPORATED, Corning, NY (US)
PCT Filed May 23, 2019, PCT No. PCT/US2019/033729
§ 371(c)(1), (2) Date Nov. 19, 2020,
PCT Pub. No. WO2019/226885, PCT Pub. Date Nov. 28, 2019.
Claims priority of provisional application 62/676,400, filed on May 25, 2018.
Prior Publication US 2021/0206930 A1, Jul. 8, 2021
Int. Cl. B32B 41/00 (2006.01); C08J 7/02 (2006.01); B32B 17/10 (2006.01); B29C 71/00 (2006.01); C08J 5/12 (2006.01); C08J 7/06 (2006.01)
CPC C08J 7/02 (2013.01) [B29C 71/0009 (2013.01); B32B 17/10 (2013.01); C08J 5/12 (2013.01); C08J 7/06 (2013.01); C08J 2383/07 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of modifying a deformable substrate, the method comprising:
depositing a sessile liquid droplet on a first surface of a deformable substrate, the sessile liquid droplet forming a deformed region in the first surface of the deformable substrate, the deformed region comprising a recess and a perimeter rim, the recess extending toward a second surface of the deformable substrate, and the perimeter rim extending away from the second surface of the deformable substrate; and
curing the deformable substrate, thereby increasing an elastic modulus of the deformable substrate such that upon removal of the sessile liquid droplet, the deformed region remains in the first surface of the deformable substrate.