US 11,858,089 B2
Polishing layer and polishing method
Yu-Hao Pan, Taichung (TW); Ching-Huang Shen, Taichung (TW); and Yu-Piao Wang, Hsinchu County (TW)
Assigned to IV Technologies CO., Ltd., Taichung (TW)
Filed by IV Technologies CO., Ltd., Taichung (TW)
Filed on Oct. 16, 2019, as Appl. No. 16/655,206.
Application 16/655,206 is a division of application No. 15/635,210, filed on Jun. 28, 2017, granted, now 10,478,940.
Claims priority of application No. 105121178 (TW), filed on Jul. 5, 2016.
Prior Publication US 2020/0047307 A1, Feb. 13, 2020
Int. Cl. B24B 37/26 (2012.01); B24D 18/00 (2006.01); B24B 37/22 (2012.01); B29C 43/02 (2006.01); B29C 43/36 (2006.01); B29L 9/00 (2006.01)
CPC B24B 37/26 (2013.01) [B24B 37/22 (2013.01); B24D 18/0009 (2013.01); B24D 18/0045 (2013.01); B29C 43/021 (2013.01); B29C 43/36 (2013.01); B29C 2043/023 (2013.01); B29C 2043/3634 (2013.01); B29C 2793/009 (2013.01); B29C 2793/0027 (2013.01); B29L 2009/00 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A polishing layer having a surface pattern, wherein a cross section of the surface pattern along a direction has a plurality of grooves and a plurality of polishing portions, the direction includes a first direction parallel to an X-axis direction, a second direction parallel to a Y-axis direction, a third direction at an angle with the X-axis direction, a radius direction or a circumferential direction, and each of the grooves is disposed between every two adjacent polishing portions, wherein the polishing layer comprises:
a body layer, wherein the body layer comprises at least one flattened region; and
a surface layer disposed on a surface of the body layer, wherein the surface layer exposes the at least one flattened region of the body layer, wherein the polishing layer has a perfusion flow mark, and the at least one flattened region is located at an end of the perfusion flow mark.