US 11,858,086 B2
High-throughput, precise semiconductor slurry blending tool
Chi-Wei Chiu, Hsinchu (TW); Yung-Long Chen, New Taipei (TW); Bo-Zhang Chen, Hsinchu (TW); Chong-Cheng Su, Hsinchu (TW); Yu-Chun Chen, Hsinchu (TW); Ching-Jung Hsu, Hsinchu (TW); and Chi-Tung Lai, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed on Jun. 15, 2020, as Appl. No. 16/901,588.
Prior Publication US 2021/0387306 A1, Dec. 16, 2021
Int. Cl. B24B 37/04 (2012.01); B24B 57/02 (2006.01); H01L 21/306 (2006.01); B01F 23/50 (2022.01)
CPC B24B 37/04 (2013.01) [B24B 57/02 (2013.01); H01L 21/30625 (2013.01); B01F 23/56 (2022.01)] 20 Claims
OG exemplary drawing
 
1. A slurry blending tool, comprising:
a blending tank to receive and blend one or more materials into a slurry;
at least one inlet pipe connected to a top portion of the blending tank and to provide the one or more materials to the blending tank,
wherein the at least one inlet pipe vertically enters the blending tank and does not contact the blending tank;
a blending pump partially provided within the blending tank and to blend the one or more materials into the slurry; and
an outlet pipe connected to a bottom portion of the blending pump and to remove the slurry from the blending tank.