US 11,858,074 B2
Medical apparatus remanufacturing method
Tatsuya Suzuki, Hachioji (JP); and Hideo Sanai, Hachioji (JP)
Assigned to OLYMPUS CORPORATION, Tokyo (JP)
Filed by OLYMPUS CORPORATION, Hachioji (JP)
Filed on Oct. 23, 2020, as Appl. No. 17/078,162.
Application 17/078,162 is a continuation of application No. PCT/JP2018/025876, filed on Jul. 9, 2018.
Prior Publication US 2021/0053165 A1, Feb. 25, 2021
Int. Cl. A61B 17/00 (2006.01); A61B 17/32 (2006.01); A61B 18/00 (2006.01); A61B 18/14 (2006.01); B23P 11/02 (2006.01); B23P 6/00 (2006.01); A61L 2/20 (2006.01); A61B 90/00 (2016.01); A61L 101/02 (2006.01); A61L 101/44 (2006.01)
CPC B23P 11/025 (2013.01) [A61B 17/320068 (2013.01); A61B 18/14 (2013.01); A61L 2/206 (2013.01); A61L 2/208 (2013.01); B23P 6/00 (2013.01); A61B 2017/00526 (2013.01); A61B 2017/320082 (2017.08); A61B 2018/00607 (2013.01); A61B 2018/00994 (2013.01); A61B 2090/0813 (2016.02); A61L 2101/02 (2020.08); A61L 2101/44 (2020.08); A61L 2202/24 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A medical apparatus remanufacturing method comprising:
disassembling a housing including a first housing and a second housing, the first housing including a boss that is press-fitted to a boss hole of a press-fitted portion of the second housing in an assembled state in which the first housing and the second housing are assembled to each other, the disassembling including:
heating the press-fitted portion through a hole formed in the second housing so as to thermally expand the boss hole to decrease a contact surface pressure between the boss and the boss hole, the hole extending from an opening at an outer surface of the second housing toward the press-fitted portion; and
removing the boss from the boss hole to release the assembled state.