US 10,172,238 B2
Multilayer capacitor and board having the same
Ho Sam Choi, Suwon-si (KR); and Ki Pyo Hong, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do (KR)
Filed on Apr. 20, 2017, as Appl. No. 15/492,447.
Claims priority of application No. 10-2016-0092759 (KR), filed on Jul. 21, 2016.
Prior Publication US 2018/0027658 A1, Jan. 25, 2018
Int. Cl. H01G 4/012 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01)
CPC H05K 1/181 (2013.01) [H01G 4/012 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H05K 1/111 (2013.01); H05K 3/3431 (2013.01); H05K 2201/10015 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A multilayer capacitor comprising:
a capacitor body with one mounting surface and including first and second internal electrodes alternately stacked, with dielectric layers interposed therebetween, each exposed at the mounting surface, and first and second groove parts at the mounting surface, spaced apart in a length direction of the capacitor body, and contacting exposed portions of the first and second internal electrodes, respectively; and
first and second external electrodes in the first and second groove parts, respectively, and electrically connected to the exposed portions of the first and second internal electrodes, respectively.