US 10,172,235 B1
Wiring board and method for manufacturing the same
Masaaki Harazono, Kirishima (JP)
Assigned to KYOCERA CORPORATION, Kyoto-Shi, Kyoto (JP)
Filed by KYOCERA Corporation, Kyoto-shi, Kyoto (JP)
Filed on Jun. 5, 2018, as Appl. No. 16/278.
Claims priority of application No. 2017-123966 (JP), filed on Jun. 26, 2017.
Int. Cl. H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/0298 (2013.01) [H05K 1/024 (2013.01); H05K 1/0242 (2013.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A wiring board comprising: a laminate in which at least one first insulating layer and at least one second insulating layer are alternately positioned, the at least one first insulating layer containing first insulating particles and a first insulating resin, the at least one second insulating layer containing second insulating particles having a particle size smaller than a particle size of the first insulating particles and a second insulating resin; a groove for wiring positioned at least on an upper surface of the laminate and comprising a side surface and a bottom surface; a via hole positioned in the first insulating layer of the laminate; and a wiring conductor positioned in the groove for wiring and in the via hole; where the bottom surface of the groove for wiring is positioned in the second insulating layer; and wherein the bottom surface of the groove for wiring is positioned in the second insulating layer, wherein the side surface of the groove for wiring is positioned only in the second insulating layer, and a cross section of the second insulating particles and a cross section of the second insulating resin are positioned to be flush with each other on the side surface.