US 10,172,232 B2
Tamper-respondent assemblies with enclosure-to-board protection
William L. Brodsky, Binghamton, NY (US); James A. Busby, New Paltz, NY (US); Edward N. Cohen, Poughkeepsie, NY (US); Silvio Dragone, Winterthur (CH); Michael J. Fisher, Poughkeepsie, NY (US); David C. Long, Wappingers Falls, NY (US); Michael T. Peets, Staatsburg, NY (US); William Santiago-Fernandez, Poughkeepsie, NY (US); and Thomas Weiss, Poughkeepsie, NY (US)
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed on Nov. 30, 2017, as Appl. No. 15/827,275.
Application 15/827,275 is a continuation of application No. 15/423,833, filed on Feb. 3, 2017, granted, now 9,877,383.
Application 15/423,833 is a continuation of application No. 15/193,525, filed on Jun. 27, 2016, granted, now 9,661,747, issued on May 23, 2017.
Application 15/193,525 is a continuation of application No. 14/974,036, filed on Dec. 18, 2015, granted, now 9,554,477, issued on Jan. 24, 2017.
Prior Publication US 2018/0098423 A1, Apr. 5, 2018
Int. Cl. G08B 21/00 (2006.01); H05K 1/02 (2006.01); H05K 5/02 (2006.01); H05K 1/18 (2006.01); G08B 13/12 (2006.01); H05K 3/22 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/0275 (2013.01) [G08B 13/128 (2013.01); H05K 1/0216 (2013.01); H05K 1/181 (2013.01); H05K 3/22 (2013.01); H05K 5/0208 (2013.01); H05K 1/112 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10265 (2013.01); H05K 2201/10371 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A tamper-respondent assembly comprising:
a circuit board;
an enclosure adhesively secured to a surface of the circuit board via a first adhesive, the enclosure facilitating enclosing at least one electronic component within a secure volume;
a tamper-respondent electronic circuit structure facilitating defining the secure volume, the tamper-respondent electronic circuit structure comprising a tamper-respondent circuit with at least one circuit line disposed on the surface of the circuit board and extending around an inner periphery of an enclosure-to-board interface where the enclosure mounts to the circuit board via the first adhesive; and
a second adhesive securing, in part, the enclosure to the circuit board, the second adhesive being a different adhesive than the first adhesive, and covering, at least in part, the tamper-respondent circuit of the tamper-respondent electronic circuit structure, wherein the second adhesive is disposed, in part, on the surface of the circuit board at the inner periphery of the enclosure-to-board interface where the enclosure mounts to the circuit board, and the second adhesive extends around the inner periphery of the enclosure-to-board interface where the enclosure mounts to the circuit board, and separation of the electronic enclosure from the circuit board causes the second adhesive to break the tamper-respondent circuit, thereby facilitating detection of the separation.